Electrothermal Signoff with RedHawk‑SC Electrothermal

Discover how Synopsys RedHawk‑SC Electrothermal™ delivers a comprehensive multiphysics solution for 2.5D/3DIC prototyping, analysis, and signoff, ensuring thermal, power, signal, and structural integrity across the chip‑package‑system for advanced multi-die designs.

Learn how its unified platform integrates hierarchical modeling, reduced‑order models, and multiphysics solvers to enable early feasibility analysis through layout‑based signoff, accelerating system technology co‑optimization (STCO) and improving design reliability. 

Highlights:

• Multiphysics signoff for 2.5D/3D multi-die designs
• Unified chip package system modeling and analysis platform 
• Foundry certified workflows for advanced packaging technologies